Effect of kerf filler on the electromechanical coupling coefficient of an ultrasonic transducer array element

Jungsoon Kim, Moojoon Kim, Wenwu Cao

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

Electromechanical coupling coefficient directly reflects the electromechanical energy conversion capability of a piezoelectric device. We show theoretically that the kerf filler in the ultrasonic array transducer can degrade this coupling coefficient. A closed form expression has been derived that can quantitatively describe the electromechanical coupling coefficient of an ultrasonic transducer array element with arbitrary aspect ratio and having polymer kerf filler in between transducer elements.

Original languageEnglish (US)
Article number152904
JournalApplied Physics Letters
Volume91
Issue number15
DOIs
StatePublished - 2007

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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