Effect of micropillar with free-end on heat transfer

Hanieh Tabkhi, Arash Nayebzadeh, Yingying Wang, Yoav Peles

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

At present study, conjugate heat transfer effects of a free-ended micropillar within a channel was investigated numerically. There is a gap between pillar tip and upper channel wall while the pillar is attached to the end wall at the other side. Two design configurations were considered based on the heater location. In one design, the bottom channel wall where the pillar is attached is the heated surface while in the other design, the heater is located on the opposite wall of a pillar with tip gap. Also, a full height pillar attached to the ends walls from both sides is modeled as a baseline for comparison. In all designs, the heater was deposited onto a Pyrex substrate. Different tip gaps were investigated and results show that introducing free-ended pillar change the heat flux distribution over the heater. Average Nusselt number over the heated surface show a minimal decrease in both designs compared to the full pillar. Nusselt number in the wake region downstream the pillar significantly increases when the heater is located at the opposite side of the tip gap.

Original languageEnglish (US)
Title of host publicationProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1209-1213
Number of pages5
ISBN (Electronic)9781509029945
DOIs
StatePublished - Jul 25 2017
Event16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 - Orlando, United States
Duration: May 30 2017Jun 2 2017

Publication series

NameProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017

Other

Other16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
Country/TerritoryUnited States
CityOrlando
Period5/30/176/2/17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

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