Effect of microwave and conventional heating on sintering behavior of tungsten coated-copper powder

Avijit Mondal, Dinesh Kumar Agrawal, Anish Upadhyaya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

W-Cu composites are most commonly used as electrical contacts and thermal management devices. In the W-Cu systems a large wetting angle of liquid copper, a high dihedral angle and almost negligible solubility between tungsten and copper make it difficult in achieving high density because densification during liquid phase sintering of W-Cu is limited to rearrangement of the W particles and solid-state sintering of the W skeleton. However, one of the methods of increasing densification is by employing Cu-coating on W powder which increases rearrangement leading to higher densification. This study examines the effect of heating mode (conventional and microwave) and temperature on the sinterability of specially prepared commercial W-15Cu (by weight) powder of approximately 2 μm particle size , supplied by Osram Sylvania, Towanda, USA. The densification behavior and properties of the samples sintered by two methods have been studied and compared.

Original languageEnglish (US)
Title of host publicationProceedings of the 7th International Conference on Tungsten, Refractory and Hardmaterials
Pages3134-3143
Number of pages10
StatePublished - 2008
Event7th International Conference on Tungsten, Refractory and Hardmaterials 2008 - Washington, DC, United States
Duration: Jun 8 2008Jun 12 2008

Other

Other7th International Conference on Tungsten, Refractory and Hardmaterials 2008
CountryUnited States
CityWashington, DC
Period6/8/086/12/08

All Science Journal Classification (ASJC) codes

  • Metals and Alloys
  • Surfaces and Interfaces

Fingerprint Dive into the research topics of 'Effect of microwave and conventional heating on sintering behavior of tungsten coated-copper powder'. Together they form a unique fingerprint.

Cite this