Effect of processing defects on stress-strain-Ic for AgMg sheathed Bi-2212 tapes

A. L. Mbaruku, K. R. Marken, M. Meinesz, H. Miao, P. V.P.S.S. Sastry, J. Schwartz

Research output: Contribution to journalConference article

11 Scopus citations

Abstract

Manufacture of multifilamentary BSCCO tapes involves rolling of billets to final form. In BSCCO-2212 tapes, one method used to control the microstructure and increase Jc is intermediate annealing during the deformation process. At times, small bubbles have been observed on the tapes after annealing. Although such bubbles do not remain at the end of fabrication, the question of possible effect on superconducting performance has been studied. The sections that had bubbles after annealing were marked and the fabrication process completed on the tape. After final reaction of the tape, comparisons of stress-strain-Ic for bubbled and nonbubbled sections were performed. Here we present electrical, mechanical and microstructural studies on bubbled and bubble-free sections of tape. It was found that sections with bubbles had lower Ic than sections with no bubbles, though both had similar onset of Ic degradation at ∼ 0.40%.

Original languageEnglish (US)
Pages (from-to)3522-3525
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume13
Issue number2 III
DOIs
Publication statusPublished - Jun 1 2003
Event2002 Applied Superconductivity Conference - Houston, TX, United States
Duration: Aug 4 2002Aug 9 2002

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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