YBa2Cu3Ox films were fabricated on 10-cm-diameter polycrystalline MgO wafers by spray pryolysis of a metal acetate solution. In-plane residual stress of the films was obtained by shadow Moiré interferometry and correlated with crack formation and critical current density. High tensile stresses (0.96 GPa) were measured at the wafer center and decreased toward the edge, which corresponded with the largest number of cracks and lowest critical current density at the wafer center. A major cause of the residual stress (0.5 GPa) was caused by a tetragonal-to-orthorhombic phase transition in YBa2Cu3Ox.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)