Effect of residual stress on critical current density of YBa2Cu3O7-x thick films

W. Wu, M. T. Lanagan, R. B. Poeppel, B. Wang, S. Danyluk

Research output: Contribution to journalArticle

Abstract

YBa2Cu3Ox films were fabricated on 10-cm-diameter polycrystalline MgO wafers by spray pryolysis of a metal acetate solution. In-plane residual stress of the films was obtained by shadow Moiré interferometry and correlated with crack formation and critical current density. High tensile stresses (0.96 GPa) were measured at the wafer center and decreased toward the edge, which corresponded with the largest number of cracks and lowest critical current density at the wafer center. A major cause of the residual stress (0.5 GPa) was caused by a tetragonal-to-orthorhombic phase transition in YBa2Cu3Ox.

Original languageEnglish (US)
Pages (from-to)387-390
Number of pages4
JournalApplied Superconductivity
Volume2
Issue number6
DOIs
StatePublished - Jun 1994

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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