Effect of solder thickness on mechanical reliability of die-bonded chip package during chip encapsulation and accelerated thermal cycling

K. Ramakrishna, T. Y. Wu, E. M. Mockensturm

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Fingerprint

    Dive into the research topics of 'Effect of solder thickness on mechanical reliability of die-bonded chip package during chip encapsulation and accelerated thermal cycling'. Together they form a unique fingerprint.

    Engineering & Materials Science