Effect of solidification conditions on partial melt processed Bi2212/Ag round wire

W. T. Nachtrab, X. T. Liu, T. Wong, J. Schwartz

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Abstract

In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher Ic compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on Ic than the initial cooling rate.

Original languageEnglish (US)
Article number5696776
Pages (from-to)2795-2799
Number of pages5
JournalIEEE Transactions on Applied Superconductivity
Volume21
Issue number3 PART 3
DOIs
Publication statusPublished - Jun 1 2011

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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