Silica sol/gel thin films were deposited on silicon wafers by spinning solutions of varying H2O/TEOS ratio. It was found that the density of the initial microporous dried gel film increases with the H2O/TEOS ratio. Consequently, the amount of film shrinkage observed during thermal treatment in N2 or NH3 was decreased with increasing H2O/TEOS. This is contrary to the behavior of bulk gels derived from solutions of increasing H2O/TEOS ratio. Most significant, though, was the enhanced incorporation of nitrogen during ammonia treatment of the films prepared with solutions of increasing H2O/TEOS ratio. Moreover, there was some indication that the nitrided films obtained after the ammonia treatment may limit oxidation of the silicon wafer.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Condensed Matter Physics
- Materials Chemistry