Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball

Daokun Liao, Dan Su, Sheng Liu, Xiaotian Li, Honghai Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed the air pressure and exhaust pipe length to analysis how they influenced the size and uniformity of the solder balls. Furthermore, we changed the deposition height to study how they influenced the morphology of the deposited solder balls. The results indicated that the size of the solder ball increased when the air pressure and exhaust pipe length elevated and the solder balls were uniform under different air pressure and exhaust pipe length. In addition, the surface of the deposited solder balls were smooth relatively, with no splash, no matter what the deposition height were.

Original languageEnglish (US)
Title of host publication2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
EditorsKeyun Bi, Sheng Liu, Shengjun Zhou
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1508-1511
Number of pages4
ISBN (Electronic)9781509013968
DOIs
StatePublished - Oct 4 2016
Event17th International Conference on Electronic Packaging Technology, ICEPT 2016 - Wuhan, China
Duration: Aug 16 2016Aug 19 2016

Publication series

Name2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Conference

Conference17th International Conference on Electronic Packaging Technology, ICEPT 2016
CountryChina
CityWuhan
Period8/16/168/19/16

Fingerprint

Soldering alloys
Pipe
Air
Diaphragms
Pneumatics
Packaging
Metals

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

Cite this

Liao, D., Su, D., Liu, S., Li, X., & Zhang, H. (2016). Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball. In K. Bi, S. Liu, & S. Zhou (Eds.), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016 (pp. 1508-1511). [7583409] (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2016.7583409
Liao, Daokun ; Su, Dan ; Liu, Sheng ; Li, Xiaotian ; Zhang, Honghai. / Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball. 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. editor / Keyun Bi ; Sheng Liu ; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1508-1511 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).
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abstract = "As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed the air pressure and exhaust pipe length to analysis how they influenced the size and uniformity of the solder balls. Furthermore, we changed the deposition height to study how they influenced the morphology of the deposited solder balls. The results indicated that the size of the solder ball increased when the air pressure and exhaust pipe length elevated and the solder balls were uniform under different air pressure and exhaust pipe length. In addition, the surface of the deposited solder balls were smooth relatively, with no splash, no matter what the deposition height were.",
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Liao, D, Su, D, Liu, S, Li, X & Zhang, H 2016, Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball. in K Bi, S Liu & S Zhou (eds), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016., 7583409, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Institute of Electrical and Electronics Engineers Inc., pp. 1508-1511, 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 8/16/16. https://doi.org/10.1109/ICEPT.2016.7583409

Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball. / Liao, Daokun; Su, Dan; Liu, Sheng; Li, Xiaotian; Zhang, Honghai.

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. ed. / Keyun Bi; Sheng Liu; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1508-1511 7583409 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball

AU - Liao, Daokun

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AU - Zhang, Honghai

PY - 2016/10/4

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N2 - As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed the air pressure and exhaust pipe length to analysis how they influenced the size and uniformity of the solder balls. Furthermore, we changed the deposition height to study how they influenced the morphology of the deposited solder balls. The results indicated that the size of the solder ball increased when the air pressure and exhaust pipe length elevated and the solder balls were uniform under different air pressure and exhaust pipe length. In addition, the surface of the deposited solder balls were smooth relatively, with no splash, no matter what the deposition height were.

AB - As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed the air pressure and exhaust pipe length to analysis how they influenced the size and uniformity of the solder balls. Furthermore, we changed the deposition height to study how they influenced the morphology of the deposited solder balls. The results indicated that the size of the solder ball increased when the air pressure and exhaust pipe length elevated and the solder balls were uniform under different air pressure and exhaust pipe length. In addition, the surface of the deposited solder balls were smooth relatively, with no splash, no matter what the deposition height were.

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Liao D, Su D, Liu S, Li X, Zhang H. Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball. In Bi K, Liu S, Zhou S, editors, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1508-1511. 7583409. (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). https://doi.org/10.1109/ICEPT.2016.7583409