Effects of sintering conditions on the diffusion bonding of AGC-Cu electrical contacts

Daudi R. Waryoba, Linsea Paradis, Arthur E. Jones, Adrew Bigley

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts has shown to be challenging process due to the immiscibility of graphite in copper and silver. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. Microhardness, electrical resistivity, electron backscatter diffraction (EBSD), and shear testing, are some of the techniques used to characterize the microstructure of diffusion bonded parts.

Original languageEnglish (US)
Title of host publicationAdvances in Powder Metallurgy and Particulate Materials - 2019
Subtitle of host publicationProceedings of the 2019 International Conference on Powder Metallurgy and Particulate Materials
PublisherMetal Powder Industries Federation
Pages305-315
Number of pages11
ISBN (Electronic)9781943694211
StatePublished - Jan 1 2020
Event2019 International Conference on Powder Metallurgy and Particulate Materials, POWDERMET 2019 - Phoenix, United States
Duration: Jun 23 2019Jun 26 2019

Publication series

NameAdvances in Powder Metallurgy and Particulate Materials - 2019: Proceedings of the 2019 International Conference on Powder Metallurgy and Particulate Materials

Conference

Conference2019 International Conference on Powder Metallurgy and Particulate Materials, POWDERMET 2019
CountryUnited States
CityPhoenix
Period6/23/196/26/19

All Science Journal Classification (ASJC) codes

  • Metals and Alloys
  • Materials Chemistry
  • Surfaces and Interfaces

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  • Cite this

    Waryoba, D. R., Paradis, L., Jones, A. E., & Bigley, A. (2020). Effects of sintering conditions on the diffusion bonding of AGC-Cu electrical contacts. In Advances in Powder Metallurgy and Particulate Materials - 2019: Proceedings of the 2019 International Conference on Powder Metallurgy and Particulate Materials (pp. 305-315). (Advances in Powder Metallurgy and Particulate Materials - 2019: Proceedings of the 2019 International Conference on Powder Metallurgy and Particulate Materials). Metal Powder Industries Federation.