Electrical and thermal layout design and optimization considerations for DPS active IPEM

Ying Feng Pang, Jonah Zhou Chen, Elaine P. Scott, Karen A. Thole

Research output: Contribution to journalConference article

Abstract

A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.

Original languageEnglish (US)
Pages (from-to)253-259
Number of pages7
JournalAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume372
Issue number7
DOIs
Publication statusPublished - Dec 1 2002
Event2002 ASME International Mechanical Engineering Congress and Exposition - New Orleans, LA, United States
Duration: Nov 17 2002Nov 22 2002

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All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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