Electrical and thermal layout design considerations for integrated power electronics modules

Jonah Zhou Chen, Ying Feng Pang, Dushan Boroyevich, Elaine P. Scott, Karen Ann Thole

Research output: Contribution to journalConference articlepeer-review

17 Scopus citations

Abstract

A methodology was developed to optimize the 3D geometrical design layout of an Active Integrated Power Electronics Module (IPEM) by considering both electrical and thermal performance. This paper is focused on the electrical analysis, including the parasitic extraction done by the Maxwell Q3D Extractor. A parametric study was conducted to determine the common model EMI noise of several different layouts. The final design layout was achieved after tradeoff between electrical and thermal performance.

Original languageEnglish (US)
Pages (from-to)242-246
Number of pages5
JournalConference Record - IAS Annual Meeting (IEEE Industry Applications Society)
Volume1
StatePublished - Jan 1 2002
Event37th IAS Annual Meeting and World Conference on Industrial applications of Electrical Energy - Pittsburgh, PA, United States
Duration: Oct 13 2002Oct 18 2002

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Electrical and thermal layout design considerations for integrated power electronics modules'. Together they form a unique fingerprint.

Cite this