Abstract
Cracks in solid-state materials are typically irreversible. Here we report electrically reversible opening and closing of nanoscale cracks in an intermetallic thin film grown on a ferroelectric substrate driven by a small electric field (~0.83 kV/cm). Accordingly, a nonvolatile colossal electroresistance on-off ratio of more than 108 is measured across the cracks in the intermetallic film at room temperature. Cracks are easily formed with low-frequency voltage cycling and remain stable when the device is operated at high frequency, which offers intriguing potential for next-generation high-frequency memory applications. Moreover, endurance testing demonstrates that the opening and closing of such cracks can reach over 107 cycles under 10-μs pulses, without catastrophic failure of the film.
| Original language | English (US) |
|---|---|
| Article number | 9 |
| Journal | Nature communications |
| Volume | 9 |
| Issue number | 1 |
| DOIs | |
| State | Published - Dec 1 2018 |
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All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Biochemistry, Genetics and Molecular Biology(all)
- Physics and Astronomy(all)
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Electrically reversible cracks in an intermetallic film controlled by an electric field. / Liu, Z. Q.; Liu, J. H.; Biegalski, M. D.; Hu, J. M.; Shang, S. L.; Ji, Y.; Wang, J. M.; Hsu, S. L.; Wong, A. T.; Cordill, M. J.; Gludovatz, B.; Marker, C.; Yan, H.; Feng, Z. X.; You, L.; Lin, M. W.; Ward, T. Z.; Liu, Z. K.; Jiang, C. B.; Chen, L. Q.; Ritchie, R. O.; Christen, H. M.; Ramesh, R.
In: Nature communications, Vol. 9, No. 1, 9, 01.12.2018.Research output: Contribution to journal › Article
TY - JOUR
T1 - Electrically reversible cracks in an intermetallic film controlled by an electric field
AU - Liu, Z. Q.
AU - Liu, J. H.
AU - Biegalski, M. D.
AU - Hu, J. M.
AU - Shang, S. L.
AU - Ji, Y.
AU - Wang, J. M.
AU - Hsu, S. L.
AU - Wong, A. T.
AU - Cordill, M. J.
AU - Gludovatz, B.
AU - Marker, C.
AU - Yan, H.
AU - Feng, Z. X.
AU - You, L.
AU - Lin, M. W.
AU - Ward, T. Z.
AU - Liu, Z. K.
AU - Jiang, C. B.
AU - Chen, L. Q.
AU - Ritchie, R. O.
AU - Christen, H. M.
AU - Ramesh, R.
PY - 2018/12/1
Y1 - 2018/12/1
N2 - Cracks in solid-state materials are typically irreversible. Here we report electrically reversible opening and closing of nanoscale cracks in an intermetallic thin film grown on a ferroelectric substrate driven by a small electric field (~0.83 kV/cm). Accordingly, a nonvolatile colossal electroresistance on-off ratio of more than 108 is measured across the cracks in the intermetallic film at room temperature. Cracks are easily formed with low-frequency voltage cycling and remain stable when the device is operated at high frequency, which offers intriguing potential for next-generation high-frequency memory applications. Moreover, endurance testing demonstrates that the opening and closing of such cracks can reach over 107 cycles under 10-μs pulses, without catastrophic failure of the film.
AB - Cracks in solid-state materials are typically irreversible. Here we report electrically reversible opening and closing of nanoscale cracks in an intermetallic thin film grown on a ferroelectric substrate driven by a small electric field (~0.83 kV/cm). Accordingly, a nonvolatile colossal electroresistance on-off ratio of more than 108 is measured across the cracks in the intermetallic film at room temperature. Cracks are easily formed with low-frequency voltage cycling and remain stable when the device is operated at high frequency, which offers intriguing potential for next-generation high-frequency memory applications. Moreover, endurance testing demonstrates that the opening and closing of such cracks can reach over 107 cycles under 10-μs pulses, without catastrophic failure of the film.
UR - http://www.scopus.com/inward/record.url?scp=85040055637&partnerID=8YFLogxK
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U2 - 10.1038/s41467-017-02454-8
DO - 10.1038/s41467-017-02454-8
M3 - Article
C2 - 29298986
AN - SCOPUS:85040055637
VL - 9
JO - Nature Communications
JF - Nature Communications
SN - 2041-1723
IS - 1
M1 - 9
ER -