Electronics anywhere

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The recent technological advancements has lead to a widespread explosion of electronics anywhere applications. The details of device structures, performance, and electrical and environmental stability are critically related to the success of various application possibilities. Many substrates in addition to high temperature polymers are of interest for electronics anywhere applications including low temperature polymers, papers and cloth. An evolutionary approach to electronics anywhere is very much practical, and the fabrication of devices and systems on arbitrary substrates is expected to require some process modification.

Original languageEnglish (US)
Title of host publicationDevice Research Conference - Conference Digest, 62nd DRC
Pages7-10
Number of pages4
DOIs
StatePublished - Dec 1 2004
EventDevice Research Conference - Conference Digest, 62nd DRC - Notre Dame, IN, United States
Duration: Jun 21 2004Jun 23 2004

Publication series

NameDevice Research Conference - Conference Digest, DRC
ISSN (Print)1548-3770

Other

OtherDevice Research Conference - Conference Digest, 62nd DRC
Country/TerritoryUnited States
CityNotre Dame, IN
Period6/21/046/23/04

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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