Enhancing discharged energy density of polymer dielectrics at high temperature by nanofillers

Xin Chen, Tian Zhang, Q. M. Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The increased functionality and miniaturization of the modern electronic and electric systems, and needs for operation at high temperatures (> 150 °C) require the development of high temperature polymer capacitors. However, at high temperatures, the present polymer dielectrics cannot deliver a large discharged energy density. This is caused by a large conduction loss at high electric field and high temperature. Here, we present our recent study, revealing that in high temperature (high glass transition, Tg) dipolar polymers, adding a small amount of nanofillers (< 1 volume %) can greatly enhance the discharged energy density. Several types of high Tg polymers, including Polyimide (PI), Polyetherimide (PEI), Polyaromatic ether ketone (PAEK), and Polyarylene methyl ether urea (PEMEU) were selected for the study.

Original languageEnglish (US)
Title of host publication2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages348-351
Number of pages4
ISBN (Electronic)9781728131214
DOIs
StatePublished - Oct 2019
Event2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States
Duration: Oct 20 2019Oct 23 2019

Publication series

NameAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume2019-October
ISSN (Print)0084-9162

Conference

Conference2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
CountryUnited States
CityRichland
Period10/20/1910/23/19

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Chen, X., Zhang, T., & Zhang, Q. M. (2019). Enhancing discharged energy density of polymer dielectrics at high temperature by nanofillers. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings (pp. 348-351). [9010532] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP47102.2019.9010532