Evaluation of film adhesion to substrates by means of surface acoustic wave dispersion

Jikai Du, Bernhard R. Tittmann, Hyeong Sick Ju

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

For thin film structures acoustically classified as slow-on-fast systems, modeling and evaluation of their interfacial condition are known to be very complex and difficult due to dispersion and multi-mode excitation of acoustic waves. This paper presents a quantitative model and a reliable measurement procedure established for adhesion evaluation of such film structures. An effective interface model employing a virtual intermediate layer is utilized for the dispersion prediction of the surface acoustic wave, which is affected by various interfacial conditions. Through acoustic microscopy experiments, this model presents a potential method to classify the bonding condition. Comparisons with a destructive scratch test and an acoustic imaging verify the failure mode of the film structure.

Original languageEnglish (US)
Pages (from-to)5786-5795
Number of pages10
JournalThin Solid Films
Volume518
Issue number20
DOIs
StatePublished - Aug 2 2010

Fingerprint

wave dispersion
Surface waves
adhesion
Adhesion
Acoustic waves
acoustics
evaluation
destructive tests
Substrates
Acoustic imaging
acoustic imaging
failure modes
Failure modes
microscopy
Thin films
thin films
predictions
excitation
Experiments

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Du, Jikai ; Tittmann, Bernhard R. ; Ju, Hyeong Sick. / Evaluation of film adhesion to substrates by means of surface acoustic wave dispersion. In: Thin Solid Films. 2010 ; Vol. 518, No. 20. pp. 5786-5795.
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Evaluation of film adhesion to substrates by means of surface acoustic wave dispersion. / Du, Jikai; Tittmann, Bernhard R.; Ju, Hyeong Sick.

In: Thin Solid Films, Vol. 518, No. 20, 02.08.2010, p. 5786-5795.

Research output: Contribution to journalArticle

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