Evaluation of film adhesion to substrates by means of surface acoustic wave dispersion

Jikai Du, Bernhard R. Tittmann, Hyeong Sick Ju

Research output: Contribution to journalArticle

17 Scopus citations

Abstract

For thin film structures acoustically classified as slow-on-fast systems, modeling and evaluation of their interfacial condition are known to be very complex and difficult due to dispersion and multi-mode excitation of acoustic waves. This paper presents a quantitative model and a reliable measurement procedure established for adhesion evaluation of such film structures. An effective interface model employing a virtual intermediate layer is utilized for the dispersion prediction of the surface acoustic wave, which is affected by various interfacial conditions. Through acoustic microscopy experiments, this model presents a potential method to classify the bonding condition. Comparisons with a destructive scratch test and an acoustic imaging verify the failure mode of the film structure.

Original languageEnglish (US)
Pages (from-to)5786-5795
Number of pages10
JournalThin Solid Films
Volume518
Issue number20
DOIs
StatePublished - Aug 2 2010

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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