Evaluation of the 3D compositional heterogeneity effect on line-edge-roughness

Shuhui Kang, Wen Li Wu, Vivek M. Prabhu, Bryan D. Vogt, Eric K. Lin, Karen Turnquest

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (SciVal)


The controlling factors in the formation of the compositional heterogeneity at the deprotection front were investigated using 3D computer simulation. The results illustrate that the chemical composition fluctuation (CCF) formed by the photoresist deprotection reaction is an important factor contributing to the line-edge-roughness (LER) in addition to the deprotection gradient (DG) of the reaction front. The magnitude of the chemical composition fluctuation and the deprotection gradient are found to depend on the ratio of the deprotection reaction rate constant to diffusion coefficient (k p/D) and the number of hoping step (n) With this new finding, the influence on LER from various process/material parameters such as dose/contrast, diffusivity, and reactivity can all be understood through their effects on k p/D and n.

Original languageEnglish (US)
Title of host publicationAdvances in Resist Materials and Processing Technology XXIV
EditionPART 2
StatePublished - Oct 15 2007
EventAdvances in Resist Materials and Processing Technology XXIV - San Jose, CA, United States
Duration: Feb 26 2007Feb 28 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
NumberPART 2
ISSN (Print)0277-786X


ConferenceAdvances in Resist Materials and Processing Technology XXIV
Country/TerritoryUnited States
CitySan Jose, CA

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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