Evaluative analysis of no-clean soldering technologies for printed wiring boards and assemblies

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

While no-clean technologies do reduce adverse environmental impact, their effect on product reliability must be considered. Manufacturers who choose to convert to no-clean materials and processes need assurance that product performance is not adversely affected. Environmental effect, manufacturing capability, and product reliability are all valid criteria for a materials and process selection method.

Original languageEnglish (US)
Title of host publicationIEEE International Symposium on Electronics & the Environment
Editors Anon
PublisherIEEE
Pages106-109
Number of pages4
StatePublished - 1995
EventProceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE - Orlando, FL, USA
Duration: May 1 1995May 3 1995

Other

OtherProceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE
CityOrlando, FL, USA
Period5/1/955/3/95

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Ciocci, R. C. (1995). Evaluative analysis of no-clean soldering technologies for printed wiring boards and assemblies. In Anon (Ed.), IEEE International Symposium on Electronics & the Environment (pp. 106-109). IEEE.