The inter-relation between near-surface lattice damage and hydrogen-related effects in both the near-surface and bulk of dry etched silicon is explored. Schottky barriers used to monitor the physical etching damage show an evolution of the near-surface region during annealing that indicates hydrogen from the etch can be passivating some of the damage and affecting the electrical properties of contacts fabricated on the etched material. Spreading resistance measurements on corresponding samples allow this effect to be compared to the evolution of hydrogen-related bulk effects.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Renewable Energy, Sustainability and the Environment
- Surfaces, Coatings and Films
- Materials Chemistry