Evolution of Interfacial Microstructure during Resistance Spot Welding of Cu and Al with Ni-P Coating

Nannan Chen, Hongliang Wang, Jingjing Li, Vic Liu, James Schroth

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Evolution of Interfacial Microstructure during Resistance Spot Welding of Cu and Al with Ni-P Coating'. Together they form a unique fingerprint.

Engineering & Materials Science