Evolution of silicon cleaning technology over the last twenty years

Jerzy Ruzyllo, T. Hattori, R. E. Novak, P. Mertens, P. Besson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper briefly summarizes selected developments that were marking progress in silicon cleaning technology over the last twenty years. The occasion for this review is a 10th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing organized under the auspices of the Electrochemical Society. This review considers general trends underlying the progress in cleaning technology, specific developments in the area of removal of various types of contaminants, as well as cleaning metrology. The concluding observation from this review is that the wafer cleaning technology is keeping up with increasing needs through continuous progress in all its facets. This progress will need to continue if the challenges resulting from increased complexity of device structures, new materials used, and the need to address environmental concerns are to be resolved.

Original languageEnglish (US)
Title of host publicationECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing
Pages3-7
Number of pages5
Edition2
DOIs
StatePublished - Dec 1 2007
Event10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 212th ECS Meeting - Washington, DC, United States
Duration: Oct 7 2007Oct 12 2007

Publication series

NameECS Transactions
Number2
Volume11
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

Other10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 212th ECS Meeting
CountryUnited States
CityWashington, DC
Period10/7/0710/12/07

Fingerprint

Cleaning
Silicon
Semiconductor devices
Impurities

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Ruzyllo, J., Hattori, T., Novak, R. E., Mertens, P., & Besson, P. (2007). Evolution of silicon cleaning technology over the last twenty years. In ECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing (2 ed., pp. 3-7). (ECS Transactions; Vol. 11, No. 2). https://doi.org/10.1149/1.2779356
Ruzyllo, Jerzy ; Hattori, T. ; Novak, R. E. ; Mertens, P. ; Besson, P. / Evolution of silicon cleaning technology over the last twenty years. ECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing. 2. ed. 2007. pp. 3-7 (ECS Transactions; 2).
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Ruzyllo, J, Hattori, T, Novak, RE, Mertens, P & Besson, P 2007, Evolution of silicon cleaning technology over the last twenty years. in ECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing. 2 edn, ECS Transactions, no. 2, vol. 11, pp. 3-7, 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 212th ECS Meeting, Washington, DC, United States, 10/7/07. https://doi.org/10.1149/1.2779356

Evolution of silicon cleaning technology over the last twenty years. / Ruzyllo, Jerzy; Hattori, T.; Novak, R. E.; Mertens, P.; Besson, P.

ECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing. 2. ed. 2007. p. 3-7 (ECS Transactions; Vol. 11, No. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Ruzyllo J, Hattori T, Novak RE, Mertens P, Besson P. Evolution of silicon cleaning technology over the last twenty years. In ECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing. 2 ed. 2007. p. 3-7. (ECS Transactions; 2). https://doi.org/10.1149/1.2779356