Abstract
Plasma technology is currently being used in innumerable industrial applications. Some of the common uses of this technology include surface cleaning and treatment, sputtering and etching of semiconductor devices, excitation source for chemical analyses, cutting, environmental clean up, sterilization, and phototherapy. The harsh conditions that these devices must endure require robust refractory materials systems for their fabrication and reliability. Low Temperature Cofired Ceramic (LTCC) material systems provide a durable and cost effective platform for the manufacture of such devices, and allow for possible integration into meso-scale microsystems. Our designs are based on RF microstriplines that capacitively couple and ionize small gas discharge sites over the top electrode. In this paper, we have built several iterations of this micro-plasma generating device using LTCC materials systems. The impact of electrode ink selection and processing, lamination methods, dielectric layer thickness, and electrode design has been investigated. Several micro-plasma generating devices were then evaluated for power requirements, output stability and long-term reliability.
| Original language | English (US) |
|---|---|
| Title of host publication | IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006 |
| Pages | 444-448 |
| Number of pages | 5 |
| State | Published - Dec 1 2006 |
| Event | 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006 - Denver, CO, United States Duration: Apr 24 2006 → Apr 27 2006 |
Other
| Other | 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006 |
|---|---|
| Country/Territory | United States |
| City | Denver, CO |
| Period | 4/24/06 → 4/27/06 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Ceramics and Composites