Fabrication of hemispherical structures using semiconductor technology for use in thermonuclear fusion research

K. D. Wise, T. N. Jackson, N. A. Masnari, M. G. Robinson, D. E. Solomon, G. H. Wuttke, W. B. Rensel

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Initial investigations and laboratory experiments in the area of target fabrication using solid state circuit processing techniques to create special target components have indicated the feasibility of a unique advanced manufacturing concept. A question of the applicability of silicon integrated circuit technology and how it might be applied to the fabrication of inertial confinement fusion targets was posed. The combined efforts of the University of Michigan Electron Physics Laboratory, and the Division of Material Sciences of KMS Fusion, Inc. have provided some relatively quick and very encouraging answers and results. The initial efforts to demonstrate electron beam patterning and etching of micron-high letters through the walls of glass microballoons, the fabrication of free-standing thin-walled flanged hemispheres joined to form spherical structures, and a pellet support membrane have been the proof-of-principle milestones and goals.

Original languageEnglish (US)
Title of host publicationMicromechanics and MEMS
Subtitle of host publicationClassic and Seminal Papers to 1990
PublisherWiley-IEEE Press
Pages551-554
Number of pages4
ISBN (Electronic)9780470545263
ISBN (Print)0780310853, 9780780310858
DOIs
StatePublished - Jan 1 1997

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All Science Journal Classification (ASJC) codes

  • Computer Science(all)
  • Engineering(all)
  • Physics and Astronomy(all)
  • Energy(all)

Cite this

Wise, K. D., Jackson, T. N., Masnari, N. A., Robinson, M. G., Solomon, D. E., Wuttke, G. H., & Rensel, W. B. (1997). Fabrication of hemispherical structures using semiconductor technology for use in thermonuclear fusion research. In Micromechanics and MEMS: Classic and Seminal Papers to 1990 (pp. 551-554). Wiley-IEEE Press. https://doi.org/10.1109/9780470545263.sect11