Nondestructive evaluation of adhesively bonded joints has been under study for a number of years. Most of these efforts have involved the use of advanced signal processing and pattern recognition and are reported to have shown relatively good correlation with particular characteristics of adhesively bonded joints. Along these lines, this work combines signal processing, pattern recognition, and a high density scan into a hybrid-scheme for assessing the integrity of an adhesively bonded structure. Advantage is taken of the availability of numerical methods for calculating spatial quantities, thus allowing global characterization of an entire joint.
|Original language||English (US)|
|Number of pages||5|
|Journal||British Journal of Non-Destructive Testing|
|State||Published - Jan 1 1983|
All Science Journal Classification (ASJC) codes