Filament to filament bridging and its influence on developing high critical current density in multifilamentary Bi2Sr2CaCu 2Ox round wires

T. Shen, J. Jiang, F. Kametani, U. P. Trociewitz, D. C. Larbalestier, Justin Schwartz, E. E. Hellstrom

Research output: Contribution to journalArticlepeer-review

78 Scopus citations

Abstract

Increasing the critical current density (Jc) of the multifilamentary round wire Ag/Bi2Sr2CaCu 2Ox(2212) requires understanding its complicated microstructure, in which extensive bridges between filaments are prominent. In this first through-process quench study of 2212 round wire, we determined how its microstructure develops during a standard partial-melt process and how filament bridging occurs. We found that filaments can bond together in the melt state. As 2212 starts to grow on subsequent cooling, we observed that two types of 2212 bridges form. One type, which we call Type-A bridges, forms within filaments that bonded in the melt; Type-A bridges are single grains that span multiple bonded filaments. The other type, called Type-B bridges, form between discrete filaments through 2212 outgrowths that penetrate into the Ag matrix and intersect with other 2212 outgrowths from adjacent filaments. We believe the ability of these two types of bridges to carry inter-filament current is intrinsically different: Type-A bridges are high- Jc inter-filament paths whereas Type-B bridges contain high-angle grain boundaries and are typically weak linked. Slow cooling leads to more filament bonding, more Type-A bridges and a doubling of Jc without changing the flux pinning. We suggest that Type-A bridges create a 3D current flow that is vital to developing high Jc in multifilamentary 2212 round wire.

Original languageEnglish (US)
Article number025009
JournalSuperconductor Science and Technology
Volume23
Issue number2
DOIs
StatePublished - Jan 29 2010

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Condensed Matter Physics
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry

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