Finite element predictions of free convection heat transfer coefficients of simulated electronic circuit boards

C. Rajakumar, D. Johnson

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

A numerical simulation of the buoyancy-induced flow around microelectronic components mounted on a circuit board has been performed using the finite element method. The circuit board is modeled by a vertical plate on which rectangular strip heating surfaces are mounted. Computations have been performed in two-dimensional plane applying a simplifying assumption that the circuit board and the strip heating surfaces are infinitely long. The Navier-Stokes, the flow continuity and the energy equations for laminar flow have been considered in the finite element discretizations. Results of the computations are presented in the form of temperature contour plots and velocity vector plots in the flow field.

Original languageEnglish (US)
Pages (from-to)129-134
Number of pages6
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume111
Issue number2
StatePublished - Jun 1989

Fingerprint

Natural convection
Heat transfer coefficients
Networks (circuits)
Heating
Buoyancy
Laminar flow
Microelectronics
Flow fields
Finite element method
Computer simulation
Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

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abstract = "A numerical simulation of the buoyancy-induced flow around microelectronic components mounted on a circuit board has been performed using the finite element method. The circuit board is modeled by a vertical plate on which rectangular strip heating surfaces are mounted. Computations have been performed in two-dimensional plane applying a simplifying assumption that the circuit board and the strip heating surfaces are infinitely long. The Navier-Stokes, the flow continuity and the energy equations for laminar flow have been considered in the finite element discretizations. Results of the computations are presented in the form of temperature contour plots and velocity vector plots in the flow field.",
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Finite element predictions of free convection heat transfer coefficients of simulated electronic circuit boards. / Rajakumar, C.; Johnson, D.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 111, No. 2, 06.1989, p. 129-134.

Research output: Contribution to journalArticle

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AU - Johnson, D.

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