Finite-element study of C-ring fracture specimens for the determination of design strength data

Albert Eliot Segall, O. Jadaan, J. Palko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

To investigate the design implications of using C-ring specimens for evaluating the strength controlling flaw population(s) of ceramics when in tubular form, finite-element analysis (FEA) calculations were performed using the ANSYS code. These calculations focused on the ranges of width-to-thickness ratios required to maintain a plane stress state within the C-ring specimen during fracture. In addition, the validity of the theoretical effective-area (KA) and effective-volume (KV) relations derived during earlier analytical and experimental studies were investigated. Results of the FEA calculations indicated that a wide range of width-to-thickness ratios could be safely used to extract fracture strength design data. Moreover, the calculations confirmed the validity of the theoretical stress-area and stress-volume relations used to correlate strength defining flaw population and determine Weibull parameters. However, a tendency for the computational errors to increase with Weibull modulus was observed during the finite-element based estimations of effective-areas and -volumes.

Original languageEnglish (US)
Title of host publication11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention
PublisherASME
Pages223-228
Number of pages6
Volume83
Edition2 Pt 1
StatePublished - 1995
EventProceedings of the 1995 ASME Design Engineering Technical Conference - Boston, MA, USA
Duration: Sep 17 1995Sep 20 1995

Other

OtherProceedings of the 1995 ASME Design Engineering Technical Conference
CityBoston, MA, USA
Period9/17/959/20/95

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering

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    Segall, A. E., Jadaan, O., & Palko, J. (1995). Finite-element study of C-ring fracture specimens for the determination of design strength data. In 11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention (2 Pt 1 ed., Vol. 83, pp. 223-228). ASME.