Foldable printed circuit boards on paper substrates

Adam C. Siegel, Scott T. Phillips, Michael D. Dickey, Nanshu Lu, Zhigang Suo, George M. Whitesides

Research output: Contribution to journalArticle

481 Citations (Scopus)

Abstract

This paper describes several low-cost methods for fabricating flexible electronic circuits on paper. The circuits comprise i) metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and ii) discrete surtace-mountable electronic components that are fastened with conductive adhesive directly to the wires. These electronic circuits-like conventional printed circuit boards-can be produced with electronic components that connect on both sides of the substrate. Unlike printed circuit boards made from fiberglass, ceramics, or polyimides, however, paper can be folded and creased (repeatedly), shaped to form threedimensional structures, trimmed using scissors, used to wick fluids (e.g., for microfluidic applications) and disposed of by incineration. Paper-based electronic circuits are thin and lightweight; they should be useful for applications in consumer electronics and packaging, for disposable systems fór uses in the military and homeland security, for applications in medical sensing or low-cost portable diagnostics, for paper-based microelectromechanical systems, and for applications involving textiles

Original languageEnglish (US)
Pages (from-to)28-35
Number of pages8
JournalAdvanced Functional Materials
Volume20
Issue number1
DOIs
StatePublished - Jan 8 2010

Fingerprint

printed circuits
circuit boards
Printed circuit boards
Networks (circuits)
Substrates
electronics
Wire
Flexible electronics
Incineration
Consumer electronics
Tin
National security
Microfluidics
Polyimides
wire
MEMS
Sputtering
Zinc
incinerators
Costs

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Siegel, A. C., Phillips, S. T., Dickey, M. D., Lu, N., Suo, Z., & Whitesides, G. M. (2010). Foldable printed circuit boards on paper substrates. Advanced Functional Materials, 20(1), 28-35. https://doi.org/10.1002/adfm.200901363
Siegel, Adam C. ; Phillips, Scott T. ; Dickey, Michael D. ; Lu, Nanshu ; Suo, Zhigang ; Whitesides, George M. / Foldable printed circuit boards on paper substrates. In: Advanced Functional Materials. 2010 ; Vol. 20, No. 1. pp. 28-35.
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Siegel, AC, Phillips, ST, Dickey, MD, Lu, N, Suo, Z & Whitesides, GM 2010, 'Foldable printed circuit boards on paper substrates', Advanced Functional Materials, vol. 20, no. 1, pp. 28-35. https://doi.org/10.1002/adfm.200901363

Foldable printed circuit boards on paper substrates. / Siegel, Adam C.; Phillips, Scott T.; Dickey, Michael D.; Lu, Nanshu; Suo, Zhigang; Whitesides, George M.

In: Advanced Functional Materials, Vol. 20, No. 1, 08.01.2010, p. 28-35.

Research output: Contribution to journalArticle

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Siegel AC, Phillips ST, Dickey MD, Lu N, Suo Z, Whitesides GM. Foldable printed circuit boards on paper substrates. Advanced Functional Materials. 2010 Jan 8;20(1):28-35. https://doi.org/10.1002/adfm.200901363