Foreword

S. W. Chen, H. M. Lee, D. Swenson, C. R. Kao, S. E. Mohney, M. R. Notis, R. Schmid-Fetzer

Research output: Contribution to journalEditorial

Original languageEnglish (US)
Number of pages1
JournalJournal of Electronic Materials
Volume32
Issue number11
DOIs
StatePublished - Nov 2003

Fingerprint

soldered joints
Silicon compounds
Soldered joints
Electric contacts
silicon compounds
soldering
interfacial energy
Flip flop circuits
Soldering
optoelectronic devices
Interfacial energy
Optoelectronic devices
electric contacts
Copper
copper

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Chen, S. W., Lee, H. M., Swenson, D., Kao, C. R., Mohney, S. E., Notis, M. R., & Schmid-Fetzer, R. (2003). Foreword. Journal of Electronic Materials, 32(11). https://doi.org/10.1007/s11664-003-0001-x
Chen, S. W. ; Lee, H. M. ; Swenson, D. ; Kao, C. R. ; Mohney, S. E. ; Notis, M. R. ; Schmid-Fetzer, R. / Foreword. In: Journal of Electronic Materials. 2003 ; Vol. 32, No. 11.
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month = "11",
doi = "10.1007/s11664-003-0001-x",
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Chen, SW, Lee, HM, Swenson, D, Kao, CR, Mohney, SE, Notis, MR & Schmid-Fetzer, R 2003, 'Foreword', Journal of Electronic Materials, vol. 32, no. 11. https://doi.org/10.1007/s11664-003-0001-x

Foreword. / Chen, S. W.; Lee, H. M.; Swenson, D.; Kao, C. R.; Mohney, S. E.; Notis, M. R.; Schmid-Fetzer, R.

In: Journal of Electronic Materials, Vol. 32, No. 11, 11.2003.

Research output: Contribution to journalEditorial

TY - JOUR

T1 - Foreword

AU - Chen, S. W.

AU - Lee, H. M.

AU - Swenson, D.

AU - Kao, C. R.

AU - Mohney, S. E.

AU - Notis, M. R.

AU - Schmid-Fetzer, R.

PY - 2003/11

Y1 - 2003/11

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UR - http://www.scopus.com/inward/citedby.url?scp=0346846612&partnerID=8YFLogxK

U2 - 10.1007/s11664-003-0001-x

DO - 10.1007/s11664-003-0001-x

M3 - Editorial

AN - SCOPUS:0346846612

VL - 32

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 11

ER -

Chen SW, Lee HM, Swenson D, Kao CR, Mohney SE, Notis MR et al. Foreword. Journal of Electronic Materials. 2003 Nov;32(11). https://doi.org/10.1007/s11664-003-0001-x