Original language | English (US) |
---|---|
Number of pages | 1 |
Journal | Solid State Communications |
Volume | 150 |
Issue number | 21-22 |
DOIs | |
State | Published - Jun 1 2010 |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Condensed Matter Physics
- Materials Chemistry
Cite this
Sheng, P., Liu, C., Qian, T., & Wang, X. (2010). Foreword. Solid State Communications, 150(21-22). https://doi.org/10.1016/j.ssc.2010.01.015
@article{a263e28941014570bf8ba09df5e25173,
title = "Foreword",
author = "Ping Sheng and Chun Liu and Tiezheng Qian and Xiaoping Wang",
year = "2010",
month = "6",
day = "1",
doi = "10.1016/j.ssc.2010.01.015",
language = "English (US)",
volume = "150",
journal = "Solid State Communications",
issn = "0038-1098",
publisher = "Elsevier Limited",
number = "21-22",
}
Sheng, P, Liu, C, Qian, T & Wang, X 2010, 'Foreword', Solid State Communications, vol. 150, no. 21-22. https://doi.org/10.1016/j.ssc.2010.01.015
Foreword. / Sheng, Ping; Liu, Chun; Qian, Tiezheng; Wang, Xiaoping.
In: Solid State Communications, Vol. 150, No. 21-22, 01.06.2010.Research output: Contribution to journal › Editorial
TY - JOUR
T1 - Foreword
AU - Sheng, Ping
AU - Liu, Chun
AU - Qian, Tiezheng
AU - Wang, Xiaoping
PY - 2010/6/1
Y1 - 2010/6/1
UR - http://www.scopus.com/inward/record.url?scp=77951005896&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77951005896&partnerID=8YFLogxK
U2 - 10.1016/j.ssc.2010.01.015
DO - 10.1016/j.ssc.2010.01.015
M3 - Editorial
AN - SCOPUS:77951005896
VL - 150
JO - Solid State Communications
JF - Solid State Communications
SN - 0038-1098
IS - 21-22
ER -
Sheng P, Liu C, Qian T, Wang X. Foreword. Solid State Communications. 2010 Jun 1;150(21-22). https://doi.org/10.1016/j.ssc.2010.01.015