Original languageEnglish (US)
Number of pages1
JournalSolid State Communications
Volume150
Issue number21-22
DOIs
StatePublished - Jun 1 2010

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Sheng, P., Liu, C., Qian, T., & Wang, X. (2010). Foreword. Solid State Communications, 150(21-22). https://doi.org/10.1016/j.ssc.2010.01.015
Sheng, Ping ; Liu, Chun ; Qian, Tiezheng ; Wang, Xiaoping. / Foreword. In: Solid State Communications. 2010 ; Vol. 150, No. 21-22.
@article{a263e28941014570bf8ba09df5e25173,
title = "Foreword",
author = "Ping Sheng and Chun Liu and Tiezheng Qian and Xiaoping Wang",
year = "2010",
month = "6",
day = "1",
doi = "10.1016/j.ssc.2010.01.015",
language = "English (US)",
volume = "150",
journal = "Solid State Communications",
issn = "0038-1098",
publisher = "Elsevier Limited",
number = "21-22",

}

Sheng, P, Liu, C, Qian, T & Wang, X 2010, 'Foreword', Solid State Communications, vol. 150, no. 21-22. https://doi.org/10.1016/j.ssc.2010.01.015

Foreword. / Sheng, Ping; Liu, Chun; Qian, Tiezheng; Wang, Xiaoping.

In: Solid State Communications, Vol. 150, No. 21-22, 01.06.2010.

Research output: Contribution to journalEditorial

TY - JOUR

T1 - Foreword

AU - Sheng, Ping

AU - Liu, Chun

AU - Qian, Tiezheng

AU - Wang, Xiaoping

PY - 2010/6/1

Y1 - 2010/6/1

UR - http://www.scopus.com/inward/record.url?scp=77951005896&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77951005896&partnerID=8YFLogxK

U2 - 10.1016/j.ssc.2010.01.015

DO - 10.1016/j.ssc.2010.01.015

M3 - Editorial

AN - SCOPUS:77951005896

VL - 150

JO - Solid State Communications

JF - Solid State Communications

SN - 0038-1098

IS - 21-22

ER -