Foreword special section on micro- and nanoscale packaging

Y. C. Lee, J. Albert Chiou, Thomas Velten, William O. Hancock

Research output: Contribution to journalEditorial

1 Citation (Scopus)
Original languageEnglish (US)
Pages (from-to)531-532
Number of pages2
JournalIEEE Transactions on Advanced Packaging
Volume28
Issue number4
DOIs
StatePublished - Nov 1 2005

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Packaging

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Lee, Y. C. ; Chiou, J. Albert ; Velten, Thomas ; Hancock, William O. / Foreword special section on micro- and nanoscale packaging. In: IEEE Transactions on Advanced Packaging. 2005 ; Vol. 28, No. 4. pp. 531-532.
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Foreword special section on micro- and nanoscale packaging. / Lee, Y. C.; Chiou, J. Albert; Velten, Thomas; Hancock, William O.

In: IEEE Transactions on Advanced Packaging, Vol. 28, No. 4, 01.11.2005, p. 531-532.

Research output: Contribution to journalEditorial

TY - JOUR

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AU - Chiou, J. Albert

AU - Velten, Thomas

AU - Hancock, William O.

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JO - IEEE Transactions on Advanced Packaging

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