Foreword special section on micro- and nanoscale packaging

Y. C. Lee, J. Albert Chiou, Thomas Velten, William O. Hancock

Research output: Contribution to journalEditorial

1 Scopus citations
Original languageEnglish (US)
Pages (from-to)531-532
Number of pages2
JournalIEEE Transactions on Advanced Packaging
Volume28
Issue number4
DOIs
StatePublished - Nov 1 2005

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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