Full and partial genome-wide assembly and disassembly of the yeast transcription machinery in response to heat shock

Sara J. Zanton, B. Franklin Pugh

Research output: Contribution to journalArticlepeer-review

84 Scopus citations

Abstract

Eukaryotic genes are controlled by sequence-specific DNA-binding proteins, chromatin regulators, general transcription factors, and elongation factors. Here we examine the genome-wide location of representative members of these groups and their redistribution when the Saccharomyces cerevisiae genome is reprogrammed by heat shock. As expected, assembly of active transcription complexes is coupled to eviction of H2A.Z nucleosomes, and disassembly is coupled to the return of nucleosomes. Remarkably, a large number of promoters assemble into partial preinitiation complexes (partial PICs), containing TFIIA, TFIID (and/or SAGA), TFIIB, TFIIE, and TFIIF. However, RNA polymerase II and TFIIH are generally not recruited, and nucleosomes are not displaced. These promoters may be preparing for additional stress that naturally accompany heat stress. For example, we find that oxidative stress, which often occurs with prolonged exposure of cells to high temperature, converts partial PICs into full PICs. Partial PICs therefore represent novel regulated intermediates that assemble at promoters in the midst of chromatin.

Original languageEnglish (US)
Pages (from-to)2250-2265
Number of pages16
JournalGenes and Development
Volume20
Issue number16
DOIs
StatePublished - Aug 15 2006

All Science Journal Classification (ASJC) codes

  • Genetics
  • Developmental Biology

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