Glass Dielectrics in Extreme High-Temperature Environment

Jun Gao, Do Kyun Kwon, Steven Perini, Jeffery Long, Shihai Zhang, Michael T. Lanagan, G. Brennecka

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Thin and flexible glass ribbons can be rolled into a film capacitor structures for power electronic circuits. Glass has excellent electrical properties and is a leading candidate to replace polymer films for high-temperature applications. The dielectric properties of a low-alkali aluminoborosilicate glass were characterized up to temperatures of 400°C. Low-field permittivity values of 6 with dielectric loss below 0.01 were found for temperatures below 300°C. The dielectric breakdown strength exceeded 5 MV/cm for temperature of 400°C and high-field polarization measurements showed that glass has over 95% energy efficiency at temperatures of 200°C, which is a target temperature for high-temperature power electronic circuits driven by wide bandgap semiconductor devices.

Original languageEnglish (US)
Pages (from-to)4045-4049
Number of pages5
JournalJournal of the American Ceramic Society
Volume99
Issue number12
DOIs
StatePublished - Dec 1 2016

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

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