Thin and flexible glass ribbons can be rolled into a film capacitor structures for power electronic circuits. Glass has excellent electrical properties and is a leading candidate to replace polymer films for high-temperature applications. The dielectric properties of a low-alkali aluminoborosilicate glass were characterized up to temperatures of 400°C. Low-field permittivity values of 6 with dielectric loss below 0.01 were found for temperatures below 300°C. The dielectric breakdown strength exceeded 5 MV/cm for temperature of 400°C and high-field polarization measurements showed that glass has over 95% energy efficiency at temperatures of 200°C, which is a target temperature for high-temperature power electronic circuits driven by wide bandgap semiconductor devices.
All Science Journal Classification (ASJC) codes
- Ceramics and Composites
- Materials Chemistry