TY - GEN
T1 - Harnessing ferroelectrics for non-volatile memories and logic
AU - Gupta, Sumeet Kumar
AU - Wang, Danni
AU - George, Sumitha
AU - Aziz, Ahmedullah
AU - Li, Xueqing
AU - Datta, Suman
AU - Narayanan, Vijaykrishnan
N1 - Funding Information:
This work was supported in part by SRC-GRC, Center for Low Energy Systems Technology (LEAST) sponsored by MARCO and DARPA and in part by the NSF awards 1160483 (ASSIST), 1205618, 1213052, 1461698 and 1500848.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/5/2
Y1 - 2017/5/2
N2 - Ferroelectrics (FE) have been the materials of interest for non-volatile memories for many decades due to their hysteretic charge-voltage behavior. However, recently, the possibilities of integrating an FE in the gate stack of a transistor (forming a ferroelectric transistor or FEFET) have opened new avenues for computation and storage. The FEFETs not only enhance the design of non-volatile memories, but also lead to the unique possibilities of introducing non-volatility in close proximity with the compute elements. In this paper, we comparatively analyze several device and circuit aspects of FEFETs and FE capacitors from the perspective of designing non-volatile memory and logic. We discuss the effect of integrating an FE in a transistor structure on the remnant polarization and coercive voltage and show the importance of FE thickness optimization to design a non-volatile transistor. We also present circuit design possibilities with non-volatile FEFETs. First, the design of memories with separate read-write paths is discussed. We show that compared to FE capacitor based memories, FEFETs achieve enormous distinguishability and near read disturb free operation albeit with 2.5× higher cell area and 3.6× higher write energy at iso-write time. Second, we describe the opportunities that non-volatility combined with the three terminal architecture of FEFETs presents in the design of low power non-volatile flip-flops. We show that compared to FE capacitor based flip-flops, FEFET based design yields upto 50% lower energy and up to 40% lower delay for data back-up, along with 30% lower area.
AB - Ferroelectrics (FE) have been the materials of interest for non-volatile memories for many decades due to their hysteretic charge-voltage behavior. However, recently, the possibilities of integrating an FE in the gate stack of a transistor (forming a ferroelectric transistor or FEFET) have opened new avenues for computation and storage. The FEFETs not only enhance the design of non-volatile memories, but also lead to the unique possibilities of introducing non-volatility in close proximity with the compute elements. In this paper, we comparatively analyze several device and circuit aspects of FEFETs and FE capacitors from the perspective of designing non-volatile memory and logic. We discuss the effect of integrating an FE in a transistor structure on the remnant polarization and coercive voltage and show the importance of FE thickness optimization to design a non-volatile transistor. We also present circuit design possibilities with non-volatile FEFETs. First, the design of memories with separate read-write paths is discussed. We show that compared to FE capacitor based memories, FEFETs achieve enormous distinguishability and near read disturb free operation albeit with 2.5× higher cell area and 3.6× higher write energy at iso-write time. Second, we describe the opportunities that non-volatility combined with the three terminal architecture of FEFETs presents in the design of low power non-volatile flip-flops. We show that compared to FE capacitor based flip-flops, FEFET based design yields upto 50% lower energy and up to 40% lower delay for data back-up, along with 30% lower area.
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U2 - 10.1109/ISQED.2017.7918288
DO - 10.1109/ISQED.2017.7918288
M3 - Conference contribution
AN - SCOPUS:85019641591
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 29
EP - 34
BT - Proceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017
PB - IEEE Computer Society
T2 - 18th International Symposium on Quality Electronic Design, ISQED 2017
Y2 - 14 March 2017 through 15 March 2017
ER -