High-density solder bump interconnect for MEMS hybrid integration

Nagesh Basavanhally, Daniel Lopez, Vladimir Aksyuk, Dave Ramsey, Eric Bower, Ray Cirelli, E. Ferry, Robert Frahm, John II Gates, Fred Klemens, Warren Lai, Yee Low, William Mansfield, Chien Shing Pai, Rick Papazian, Flavio Pardo, Tom Sorsch, Pat Watson

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

An ultra high-density hybrid integration for microelectromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-μm bumps on 5-μm centers of a large array has been demonstrated.

Original languageEnglish (US)
Pages (from-to)622-628
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number4
DOIs
StatePublished - Nov 2007

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'High-density solder bump interconnect for MEMS hybrid integration'. Together they form a unique fingerprint.

Cite this