High-density solder bump interconnect for MEMS hybrid integration

Nagesh Basavanhally, Daniel Lopez, Vladimir Aksyuk, Dave Ramsey, Eric Bower, Ray Cirelli, E. Ferry, Robert Frahm, John II Gates, Fred Klemens, Warren Lai, Yee Low, William Mansfield, Chien Shing Pai, Rick Papazian, Flavio Pardo, Tom Sorsch, Pat Watson

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

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Engineering & Materials Science