High-performance biodegradable/transient electronics on biodegradable polymers

Suk Won Hwang, Jun Kyul Song, Xian Huang, Huanyu Cheng, Seung Kyun Kang, Bong Hoon Kim, Jae Hwan Kim, Sooyoun Yu, Yonggang Huang, John A. Rogers

Research output: Contribution to journalArticle

181 Citations (Scopus)

Abstract

Materials and fabrication approaches that allow integration of biodegradable/transient electronics onto diverse classes of biodegradable substrates are presented in this article. By first depositing, patterning, and etching the materials for the electronics and then integrating them on a substrate of interest, it is possible to use nearly any type of biodegradable material for this purpose. Component and system-level studies of various devices and biodegradable polymers illustrate the capabilities and operational aspects. Dissolution studies and mechanics modeling results highlight different modes for transient behavior.

Original languageEnglish (US)
Pages (from-to)3905-3911
Number of pages7
JournalAdvanced Materials
Volume26
Issue number23
DOIs
StatePublished - Jun 18 2014

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Biodegradable polymers
Electronic equipment
Substrates
Etching
Mechanics
Dissolution
Fabrication

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Hwang, S. W., Song, J. K., Huang, X., Cheng, H., Kang, S. K., Kim, B. H., ... Rogers, J. A. (2014). High-performance biodegradable/transient electronics on biodegradable polymers. Advanced Materials, 26(23), 3905-3911. https://doi.org/10.1002/adma.201306050
Hwang, Suk Won ; Song, Jun Kyul ; Huang, Xian ; Cheng, Huanyu ; Kang, Seung Kyun ; Kim, Bong Hoon ; Kim, Jae Hwan ; Yu, Sooyoun ; Huang, Yonggang ; Rogers, John A. / High-performance biodegradable/transient electronics on biodegradable polymers. In: Advanced Materials. 2014 ; Vol. 26, No. 23. pp. 3905-3911.
@article{357e6d47db7b4beabfa57d4b3e54c74c,
title = "High-performance biodegradable/transient electronics on biodegradable polymers",
abstract = "Materials and fabrication approaches that allow integration of biodegradable/transient electronics onto diverse classes of biodegradable substrates are presented in this article. By first depositing, patterning, and etching the materials for the electronics and then integrating them on a substrate of interest, it is possible to use nearly any type of biodegradable material for this purpose. Component and system-level studies of various devices and biodegradable polymers illustrate the capabilities and operational aspects. Dissolution studies and mechanics modeling results highlight different modes for transient behavior.",
author = "Hwang, {Suk Won} and Song, {Jun Kyul} and Xian Huang and Huanyu Cheng and Kang, {Seung Kyun} and Kim, {Bong Hoon} and Kim, {Jae Hwan} and Sooyoun Yu and Yonggang Huang and Rogers, {John A.}",
year = "2014",
month = "6",
day = "18",
doi = "10.1002/adma.201306050",
language = "English (US)",
volume = "26",
pages = "3905--3911",
journal = "Advanced Materials",
issn = "0935-9648",
publisher = "Wiley-VCH Verlag",
number = "23",

}

Hwang, SW, Song, JK, Huang, X, Cheng, H, Kang, SK, Kim, BH, Kim, JH, Yu, S, Huang, Y & Rogers, JA 2014, 'High-performance biodegradable/transient electronics on biodegradable polymers', Advanced Materials, vol. 26, no. 23, pp. 3905-3911. https://doi.org/10.1002/adma.201306050

High-performance biodegradable/transient electronics on biodegradable polymers. / Hwang, Suk Won; Song, Jun Kyul; Huang, Xian; Cheng, Huanyu; Kang, Seung Kyun; Kim, Bong Hoon; Kim, Jae Hwan; Yu, Sooyoun; Huang, Yonggang; Rogers, John A.

In: Advanced Materials, Vol. 26, No. 23, 18.06.2014, p. 3905-3911.

Research output: Contribution to journalArticle

TY - JOUR

T1 - High-performance biodegradable/transient electronics on biodegradable polymers

AU - Hwang, Suk Won

AU - Song, Jun Kyul

AU - Huang, Xian

AU - Cheng, Huanyu

AU - Kang, Seung Kyun

AU - Kim, Bong Hoon

AU - Kim, Jae Hwan

AU - Yu, Sooyoun

AU - Huang, Yonggang

AU - Rogers, John A.

PY - 2014/6/18

Y1 - 2014/6/18

N2 - Materials and fabrication approaches that allow integration of biodegradable/transient electronics onto diverse classes of biodegradable substrates are presented in this article. By first depositing, patterning, and etching the materials for the electronics and then integrating them on a substrate of interest, it is possible to use nearly any type of biodegradable material for this purpose. Component and system-level studies of various devices and biodegradable polymers illustrate the capabilities and operational aspects. Dissolution studies and mechanics modeling results highlight different modes for transient behavior.

AB - Materials and fabrication approaches that allow integration of biodegradable/transient electronics onto diverse classes of biodegradable substrates are presented in this article. By first depositing, patterning, and etching the materials for the electronics and then integrating them on a substrate of interest, it is possible to use nearly any type of biodegradable material for this purpose. Component and system-level studies of various devices and biodegradable polymers illustrate the capabilities and operational aspects. Dissolution studies and mechanics modeling results highlight different modes for transient behavior.

UR - http://www.scopus.com/inward/record.url?scp=84902375570&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84902375570&partnerID=8YFLogxK

U2 - 10.1002/adma.201306050

DO - 10.1002/adma.201306050

M3 - Article

C2 - 24692101

AN - SCOPUS:84902375570

VL - 26

SP - 3905

EP - 3911

JO - Advanced Materials

JF - Advanced Materials

SN - 0935-9648

IS - 23

ER -