High temperature coefficient of resistance molybdenum oxide and nickel oxide thin films for microbolometer applications

Yao O. Jin, David Saint John, Nikolas J. Podraza, Thomas N. Jackson, Mark W. Horn

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

Molybdenum oxide (MoOx ) and nickel oxide (NiOx ) thin films were deposited by reactive biased target ion beam deposition. MoOx thin film resistivity varied from 3 to 2000 ω· cm with a temperature coefficient of resistance (TCR) from ?1.7% to ?3.2%?K, and NiOx thin film resistivity varied from 1 to 300ω· cm with a TCR from ?2.2% to ?3.3%?K, both easily controlled by varying the oxygen partial pressure. Biased target ion beam deposited high TCR MoOx and NiOx thin films are polycrystalline semiconductors and have good stability in air. Compared with commonly used vanadium oxide thin films, MoOx or NiOx thin films offer improved process control for resistive temperature sensors.

Original languageEnglish (US)
Article number037101
JournalOptical Engineering
Volume54
Issue number3
DOIs
StatePublished - Mar 2015

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Engineering(all)

Fingerprint Dive into the research topics of 'High temperature coefficient of resistance molybdenum oxide and nickel oxide thin films for microbolometer applications'. Together they form a unique fingerprint.

Cite this