Highly textured and twinned Cu films fabricated by pulsed electrodeposition

B. Z. Cui, K. Han, Y. Xin, D. R. Waryoba, A. L. Mbaruku

Research output: Contribution to journalArticlepeer-review

46 Scopus citations

Abstract

This paper reports the influence of substrates and peak current densities on: crystallographic textures; twin density, thickness, spacing and twin boundary orientations; and electrical transport and mechanical properties of Cu films fabricated by pulsed electrodeposition. Films of {3 1 1}, {1 0 0}, {1 1 0} and {1 1 1} out-of-plane textured Cu with a high density of {1 1 1} twins were synthesized. With increasing twin density and change of texture by selection of the peak current densities and substrates, the ultimate tensile strength, hardness and elongation monotonically increase. This paper also discusses the mechanisms for manipulation of texture and twin densities via changing both the peak current densities and substrates, and the correlation among the microstructure, electrical resistivity and mechanical properties.

Original languageEnglish (US)
Pages (from-to)4429-4438
Number of pages10
JournalActa Materialia
Volume55
Issue number13
DOIs
StatePublished - Aug 2007

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Fingerprint Dive into the research topics of 'Highly textured and twinned Cu films fabricated by pulsed electrodeposition'. Together they form a unique fingerprint.

Cite this