Identification of trapping defects in 4H -silicon carbide metal-insulator-semiconductor field-effect transistors by electrically detected magnetic resonance

Morgen S. Dautrich, Patrick M. Lenahan, Aivars J. Lelis

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

In conventional SiSi O2 -based metal oxide semiconductor devices, performance-limiting semiconductor/dielectric interface traps are localized precisely at the SiSi O2 boundary. The authors show that in high-quality SiCSi O2 -based devices, this is not necessarily the case. Magnetic resonance and electrical measurements indicate that in relatively high quality 4H-SiC metal-insulator-semiconductor field-effect transistors, there exist relatively high concentrations of intrinsic deep level defect centers extending below the SiCSi O2 interface into the SiC bulk. The primary defect observed is almost certainly an intrinsic defect of high symmetry, most likely a silicon vacancy center.

Original languageEnglish (US)
Article number223502
JournalApplied Physics Letters
Volume89
Issue number22
DOIs
StatePublished - Dec 7 2006

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MIS (semiconductors)
silicon carbides
magnetic resonance
field effect transistors
trapping
defects
semiconductor devices
metal oxide semiconductors
electrical measurement
traps
symmetry
silicon

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

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Identification of trapping defects in 4H -silicon carbide metal-insulator-semiconductor field-effect transistors by electrically detected magnetic resonance. / Dautrich, Morgen S.; Lenahan, Patrick M.; Lelis, Aivars J.

In: Applied Physics Letters, Vol. 89, No. 22, 223502, 07.12.2006.

Research output: Contribution to journalArticle

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