Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures

S. Eachempati, Vijaykrishnan Narayanan, Arthur Nieuwoudt, Yehia Massoud

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures
Pages516-517
Number of pages2
DOIs
StatePublished - 2007
EventIEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07 - Porto Alegre, Brazil
Duration: Mar 9 2007Mar 11 2007

Other

OtherIEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07
CountryBrazil
CityPorto Alegre
Period3/9/073/11/07

Fingerprint

Field programmable gate arrays (FPGA)
Carbon nanotubes
Single-walled carbon nanotubes (SWCN)
Copper

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Eachempati, S., Narayanan, V., Nieuwoudt, A., & Massoud, Y. (2007). Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. In Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures (pp. 516-517). [4208978] https://doi.org/10.1109/ISVLSI.2007.56
Eachempati, S. ; Narayanan, Vijaykrishnan ; Nieuwoudt, Arthur ; Massoud, Yehia. / Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures. 2007. pp. 516-517
@inproceedings{3725061a21744f5791f20976a38eed38,
title = "Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures",
abstract = "As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.",
author = "S. Eachempati and Vijaykrishnan Narayanan and Arthur Nieuwoudt and Yehia Massoud",
year = "2007",
doi = "10.1109/ISVLSI.2007.56",
language = "English (US)",
isbn = "0769528961",
pages = "516--517",
booktitle = "Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures",

}

Eachempati, S, Narayanan, V, Nieuwoudt, A & Massoud, Y 2007, Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. in Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures., 4208978, pp. 516-517, IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures, ISVLSI'07, Porto Alegre, Brazil, 3/9/07. https://doi.org/10.1109/ISVLSI.2007.56

Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. / Eachempati, S.; Narayanan, Vijaykrishnan; Nieuwoudt, Arthur; Massoud, Yehia.

Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures. 2007. p. 516-517 4208978.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures

AU - Eachempati, S.

AU - Narayanan, Vijaykrishnan

AU - Nieuwoudt, Arthur

AU - Massoud, Yehia

PY - 2007

Y1 - 2007

N2 - As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.

AB - As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when bundles of single-walled carbon nanotubes (SWCNT) are used as interconnect in the FPGA routing fabric. The results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.

UR - http://www.scopus.com/inward/record.url?scp=36348999644&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=36348999644&partnerID=8YFLogxK

U2 - 10.1109/ISVLSI.2007.56

DO - 10.1109/ISVLSI.2007.56

M3 - Conference contribution

AN - SCOPUS:36348999644

SN - 0769528961

SN - 9780769528960

SP - 516

EP - 517

BT - Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures

ER -

Eachempati S, Narayanan V, Nieuwoudt A, Massoud Y. Impact of process variations on carbon nanotube bundle interconnect for future FPGA architectures. In Proceedings - IEEE Computer Society Annual Symposium on VLSI: Emerging VLSI Technologies and Architectures. 2007. p. 516-517. 4208978 https://doi.org/10.1109/ISVLSI.2007.56