Improved thermal control for a-Si:H photovoltaic cells fabricated on polymeric substrates

J. R. Huang, Y. Lee, C. M.C. Toporow, G. J. Vendura, Thomas Nelson Jackson, C. R. Wronski

Research output: Contribution to journalConference article

3 Citations (Scopus)

Abstract

The fabrication of a-Si:H photovoltaic (PV) cells on polyimide or other flexible polymeric substrates presents significant challenges compared to cells fabricated on metallized glass or metal substrates. In particular, the low thermal conductivity of polyimide materials, and the difficulty of maintaining flatness, make substrate thermal control problematic. We report here a cell fabrication process on a 2 mil thick polyimide substrate using a pressure-sensitive silicone adhesive to provide thermal contact and to control substrate warping. Results are directly compared with cells similarly fabricated but on conventional substrates.

Original languageEnglish (US)
Pages (from-to)699-702
Number of pages4
JournalConference Record of the IEEE Photovoltaic Specialists Conference
StatePublished - Dec 1 1997
EventProceedings of the 1997 IEEE 26th Photovoltaic Specialists Conference - Anaheim, CA, USA
Duration: Sep 29 1997Oct 3 1997

Fingerprint

Photovoltaic cells
Substrates
Polyimides
Fabrication
Silicones
Hot Temperature
Thermal conductivity
Adhesives
Glass
Metals

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

@article{219d1db8fc294edaae5aeb259ac7fe88,
title = "Improved thermal control for a-Si:H photovoltaic cells fabricated on polymeric substrates",
abstract = "The fabrication of a-Si:H photovoltaic (PV) cells on polyimide or other flexible polymeric substrates presents significant challenges compared to cells fabricated on metallized glass or metal substrates. In particular, the low thermal conductivity of polyimide materials, and the difficulty of maintaining flatness, make substrate thermal control problematic. We report here a cell fabrication process on a 2 mil thick polyimide substrate using a pressure-sensitive silicone adhesive to provide thermal contact and to control substrate warping. Results are directly compared with cells similarly fabricated but on conventional substrates.",
author = "Huang, {J. R.} and Y. Lee and Toporow, {C. M.C.} and Vendura, {G. J.} and Jackson, {Thomas Nelson} and Wronski, {C. R.}",
year = "1997",
month = "12",
day = "1",
language = "English (US)",
pages = "699--702",
journal = "Conference Record of the IEEE Photovoltaic Specialists Conference",
issn = "0160-8371",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

Improved thermal control for a-Si:H photovoltaic cells fabricated on polymeric substrates. / Huang, J. R.; Lee, Y.; Toporow, C. M.C.; Vendura, G. J.; Jackson, Thomas Nelson; Wronski, C. R.

In: Conference Record of the IEEE Photovoltaic Specialists Conference, 01.12.1997, p. 699-702.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Improved thermal control for a-Si:H photovoltaic cells fabricated on polymeric substrates

AU - Huang, J. R.

AU - Lee, Y.

AU - Toporow, C. M.C.

AU - Vendura, G. J.

AU - Jackson, Thomas Nelson

AU - Wronski, C. R.

PY - 1997/12/1

Y1 - 1997/12/1

N2 - The fabrication of a-Si:H photovoltaic (PV) cells on polyimide or other flexible polymeric substrates presents significant challenges compared to cells fabricated on metallized glass or metal substrates. In particular, the low thermal conductivity of polyimide materials, and the difficulty of maintaining flatness, make substrate thermal control problematic. We report here a cell fabrication process on a 2 mil thick polyimide substrate using a pressure-sensitive silicone adhesive to provide thermal contact and to control substrate warping. Results are directly compared with cells similarly fabricated but on conventional substrates.

AB - The fabrication of a-Si:H photovoltaic (PV) cells on polyimide or other flexible polymeric substrates presents significant challenges compared to cells fabricated on metallized glass or metal substrates. In particular, the low thermal conductivity of polyimide materials, and the difficulty of maintaining flatness, make substrate thermal control problematic. We report here a cell fabrication process on a 2 mil thick polyimide substrate using a pressure-sensitive silicone adhesive to provide thermal contact and to control substrate warping. Results are directly compared with cells similarly fabricated but on conventional substrates.

UR - http://www.scopus.com/inward/record.url?scp=0031369459&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031369459&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0031369459

SP - 699

EP - 702

JO - Conference Record of the IEEE Photovoltaic Specialists Conference

JF - Conference Record of the IEEE Photovoltaic Specialists Conference

SN - 0160-8371

ER -