In-plane thermal conductance measurement of one-dimensional nanostructures

Hsiao Fang Lee, Benedict A. Samuel, M. A. Haque

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3x technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.

Original languageEnglish (US)
Pages (from-to)495-500
Number of pages6
JournalJournal of Thermal Analysis and Calorimetry
Volume99
Issue number2
DOIs
StatePublished - Feb 1 2010

Fingerprint

Nanostructures
Thermal conductivity
thermal conductivity
conduction
Focused ion beams
Substrates
Platinum
Aluminum
Analytical models
platinum
ion beams
aluminum
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry

Cite this

@article{beb9dc28732041a8a5c46cc983acf316,
title = "In-plane thermal conductance measurement of one-dimensional nanostructures",
abstract = "We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3x technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.",
author = "Lee, {Hsiao Fang} and Samuel, {Benedict A.} and Haque, {M. A.}",
year = "2010",
month = "2",
day = "1",
doi = "10.1007/s10973-009-0165-6",
language = "English (US)",
volume = "99",
pages = "495--500",
journal = "Journal of Thermal Analysis and Calorimetry",
issn = "1388-6150",
publisher = "Springer Netherlands",
number = "2",

}

In-plane thermal conductance measurement of one-dimensional nanostructures. / Lee, Hsiao Fang; Samuel, Benedict A.; Haque, M. A.

In: Journal of Thermal Analysis and Calorimetry, Vol. 99, No. 2, 01.02.2010, p. 495-500.

Research output: Contribution to journalArticle

TY - JOUR

T1 - In-plane thermal conductance measurement of one-dimensional nanostructures

AU - Lee, Hsiao Fang

AU - Samuel, Benedict A.

AU - Haque, M. A.

PY - 2010/2/1

Y1 - 2010/2/1

N2 - We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3x technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.

AB - We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3x technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.

UR - http://www.scopus.com/inward/record.url?scp=77951877500&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77951877500&partnerID=8YFLogxK

U2 - 10.1007/s10973-009-0165-6

DO - 10.1007/s10973-009-0165-6

M3 - Article

AN - SCOPUS:77951877500

VL - 99

SP - 495

EP - 500

JO - Journal of Thermal Analysis and Calorimetry

JF - Journal of Thermal Analysis and Calorimetry

SN - 1388-6150

IS - 2

ER -