In-plane thermal conductance measurement of one-dimensional nanostructures

Hsiao Fang Lee, Benedict A. Samuel, M. A. Haque

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3x technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.

Original languageEnglish (US)
Pages (from-to)495-500
Number of pages6
JournalJournal of Thermal Analysis and Calorimetry
Volume99
Issue number2
DOIs
StatePublished - Feb 1 2010

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry

Fingerprint Dive into the research topics of 'In-plane thermal conductance measurement of one-dimensional nanostructures'. Together they form a unique fingerprint.

Cite this