In-process force monitoring for precision grinding semiconductor silicon wafers

Jeremiah A. Couey, Eric R. Marsh, Byron R. Knapp, R. Ryan Vallance

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of grinding forces without introducing compliance into the structural loop of the grinding machine. Aerostatic spindles are used in precision wafer grinding requiring high stiffness and very low error motions (5-25 nm). Several experiments evaluate this force sensing approach in detecting workpiece contact, process monitoring with small depths of cut, and detecting workpiece defects. The results indicate that force measurements offer good performance for monitoring precision wafer grinding since this approach provides excellent contact sensitivity, high signal resolution, and has sufficient bandwidth to detect events occurring within a single revolution of the grinding wheel.

Original languageEnglish (US)
Pages (from-to)430-440
Number of pages11
JournalInternational Journal of Manufacturing Technology and Management
Volume7
Issue number5-6
DOIs
StatePublished - 2005

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Strategy and Management
  • Industrial and Manufacturing Engineering
  • Information Systems and Management
  • Electrical and Electronic Engineering

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