In situ observation of microstrain relief in cold-sprayed bulk copper during thermal annealing

P. D. Eason, S. C. Kennett, Timothy John Eden, I. Krull, B. Kowalski, Jacob L. Jones

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

The thermal annealing behavior of copper produced by cold-spray processing was observed in situ using time-resolved X-ray diffraction during heating. The relief of microstrain is found to be coincident with the onset of grain refinement. Electron channeling contrast imaging was used to characterize grain size in pre-sprayed, sprayed and annealed conditions. Recrystallization of plastic flow regions adjacent to powder surfaces results in nanometer-sized grains, in contrast to larger grained recrystallized regions observed toward the center of the powder particles.

Original languageEnglish (US)
Pages (from-to)791-794
Number of pages4
JournalScripta Materialia
Volume67
Issue number9
DOIs
StatePublished - Nov 1 2012

Fingerprint

Powders
Copper
Annealing
copper
annealing
plastic flow
Grain refinement
Plastic flow
sprayers
grain size
Imaging techniques
Heating
X ray diffraction
heating
Electrons
Processing
diffraction
electrons
x rays
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

Cite this

Eason, P. D. ; Kennett, S. C. ; Eden, Timothy John ; Krull, I. ; Kowalski, B. ; Jones, Jacob L. / In situ observation of microstrain relief in cold-sprayed bulk copper during thermal annealing. In: Scripta Materialia. 2012 ; Vol. 67, No. 9. pp. 791-794.
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In situ observation of microstrain relief in cold-sprayed bulk copper during thermal annealing. / Eason, P. D.; Kennett, S. C.; Eden, Timothy John; Krull, I.; Kowalski, B.; Jones, Jacob L.

In: Scripta Materialia, Vol. 67, No. 9, 01.11.2012, p. 791-794.

Research output: Contribution to journalArticle

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AU - Jones, Jacob L.

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