TY - GEN
T1 - In situ stripline laminate property extraction accounting for effective surface roughness losses
AU - Ellison, Jason J.
AU - Agili, Sedig
PY - 2017/10/20
Y1 - 2017/10/20
N2 - A method of extracting the effective copper surface roughness of a laminate in situ is introduced. The rough copper attenuation, as a function of surface roughness, is removed from the total attenuation. The residual loss is fit to coefficients, and an error is calculated based on the remaining surface roughness contribution. When the error is minimized or when the apparent surface roughness contribution is zero, the effective surface roughness and dielectric loss contribution are found. Using this extracted dielectric loss, broadband causal laminate electrical properties are calculated with higher accuracy than existing methods that neglect copper surface roughness. The new method uses S-parameter measurements of stripline traces and does not require a cross-section of the sample.
AB - A method of extracting the effective copper surface roughness of a laminate in situ is introduced. The rough copper attenuation, as a function of surface roughness, is removed from the total attenuation. The residual loss is fit to coefficients, and an error is calculated based on the remaining surface roughness contribution. When the error is minimized or when the apparent surface roughness contribution is zero, the effective surface roughness and dielectric loss contribution are found. Using this extracted dielectric loss, broadband causal laminate electrical properties are calculated with higher accuracy than existing methods that neglect copper surface roughness. The new method uses S-parameter measurements of stripline traces and does not require a cross-section of the sample.
UR - http://www.scopus.com/inward/record.url?scp=85039172979&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85039172979&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2017.8077866
DO - 10.1109/ISEMC.2017.8077866
M3 - Conference contribution
AN - SCOPUS:85039172979
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 198
EP - 202
BT - 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
Y2 - 7 August 2017 through 11 August 2017
ER -