In-situ TEM mechanical testing of nanocrystalline zirconium thin films

Baoming Wang, Vikas Tomar, Aman Haque

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Mechanical behavior of nanocrystalline zirconium thin films was investigated in-situ inside a transmission electron microscope (TEM). The yield stress measured for specimens with <10 nm grain size was around 450-500 MPa compared to the bulk value of 250-300 MPa. Similar grain size effects are seen on fracture stress and strain of about 0.9 GPa and 1.5-2% respectively. Using in-situ TEM, we demonstrate control of grain size in the specimens using electro-migration stress and temperature. The experimental results suggest that the critical grain size for inverse Hall-Petch type relationship in nanocrystalline hexagonal close packed metals could be around 15 nm.

Original languageEnglish (US)
Pages (from-to)105-108
Number of pages4
JournalMaterials Letters
Volume152
DOIs
StatePublished - Aug 1 2015

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Mechanical testing
Zirconium
Electron microscopes
electron microscopes
grain size
Thin films
Electromigration
thin films
Yield stress
Metals
electromigration
Temperature
metals
temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Wang, Baoming ; Tomar, Vikas ; Haque, Aman. / In-situ TEM mechanical testing of nanocrystalline zirconium thin films. In: Materials Letters. 2015 ; Vol. 152. pp. 105-108.
@article{beb6f483c4014164b1f642985046f63f,
title = "In-situ TEM mechanical testing of nanocrystalline zirconium thin films",
abstract = "Mechanical behavior of nanocrystalline zirconium thin films was investigated in-situ inside a transmission electron microscope (TEM). The yield stress measured for specimens with <10 nm grain size was around 450-500 MPa compared to the bulk value of 250-300 MPa. Similar grain size effects are seen on fracture stress and strain of about 0.9 GPa and 1.5-2{\%} respectively. Using in-situ TEM, we demonstrate control of grain size in the specimens using electro-migration stress and temperature. The experimental results suggest that the critical grain size for inverse Hall-Petch type relationship in nanocrystalline hexagonal close packed metals could be around 15 nm.",
author = "Baoming Wang and Vikas Tomar and Aman Haque",
year = "2015",
month = "8",
day = "1",
doi = "10.1016/j.matlet.2015.03.105",
language = "English (US)",
volume = "152",
pages = "105--108",
journal = "Materials Letters",
issn = "0167-577X",
publisher = "Elsevier",

}

In-situ TEM mechanical testing of nanocrystalline zirconium thin films. / Wang, Baoming; Tomar, Vikas; Haque, Aman.

In: Materials Letters, Vol. 152, 01.08.2015, p. 105-108.

Research output: Contribution to journalArticle

TY - JOUR

T1 - In-situ TEM mechanical testing of nanocrystalline zirconium thin films

AU - Wang, Baoming

AU - Tomar, Vikas

AU - Haque, Aman

PY - 2015/8/1

Y1 - 2015/8/1

N2 - Mechanical behavior of nanocrystalline zirconium thin films was investigated in-situ inside a transmission electron microscope (TEM). The yield stress measured for specimens with <10 nm grain size was around 450-500 MPa compared to the bulk value of 250-300 MPa. Similar grain size effects are seen on fracture stress and strain of about 0.9 GPa and 1.5-2% respectively. Using in-situ TEM, we demonstrate control of grain size in the specimens using electro-migration stress and temperature. The experimental results suggest that the critical grain size for inverse Hall-Petch type relationship in nanocrystalline hexagonal close packed metals could be around 15 nm.

AB - Mechanical behavior of nanocrystalline zirconium thin films was investigated in-situ inside a transmission electron microscope (TEM). The yield stress measured for specimens with <10 nm grain size was around 450-500 MPa compared to the bulk value of 250-300 MPa. Similar grain size effects are seen on fracture stress and strain of about 0.9 GPa and 1.5-2% respectively. Using in-situ TEM, we demonstrate control of grain size in the specimens using electro-migration stress and temperature. The experimental results suggest that the critical grain size for inverse Hall-Petch type relationship in nanocrystalline hexagonal close packed metals could be around 15 nm.

UR - http://www.scopus.com/inward/record.url?scp=84926466651&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84926466651&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2015.03.105

DO - 10.1016/j.matlet.2015.03.105

M3 - Article

AN - SCOPUS:84926466651

VL - 152

SP - 105

EP - 108

JO - Materials Letters

JF - Materials Letters

SN - 0167-577X

ER -