Integration of micromachined devices and microelectronic circuits: Techniques and challenges

Srinivas A. Tadigadapa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Successful implementation of low-cost, reliable, integrated microsystems requires the integration of planar two-dimensional microelectronic circuits with three-dimensional microelectromechanical structures. Over the past several years, many methods for the integration of microcircuits with micromechanical structures have been developed. This review paper will present an overview of these techniques for integrating microelectromechanical structures with microelectronic circuits. The state-of-the-art, limitations and challenges in the realization of such integrated microsystems are discussed.

Original languageEnglish (US)
Title of host publicationMidwest Symposium on Circuits and Systems
Pages224-227
Number of pages4
Volume1
StatePublished - 2000
Event43rd Midwest Circuits and Systems Conference (MWSCAS-2000) - Lansing, MI, United States
Duration: Aug 8 2000Aug 11 2000

Other

Other43rd Midwest Circuits and Systems Conference (MWSCAS-2000)
CountryUnited States
CityLansing, MI
Period8/8/008/11/00

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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