Interactive multidisciplinary analysis, design and optimization (MDA&O) approach to electronic packaging

Norman F. Foster, George S. Dulikravich, Thomas J. Martin, Jonathan D. Halderman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have developed a unique set of robust, highly computationally efficient, and interactive computer codes for analysis, inverse design, and optimization of two-dimensional fluid flow, heat conduction, electrostatics, magnetohydrodynamics electrohydrodynamics, and elastostatics. These codes have been packaged together into a highly interactive menu-driven multidisciplinary analysis, design, and optimization (MDA&O) software product that simultaneously accounts for fluid flow, heat transfer, and elastic stresses and deformations. This package is graphically intensive, and provides the user an easy- to-operate, easy-to-understand platform from which to design and analyze many types of manufacturable components including electronic circuit board configurations. The MDA&O package allows the user to choose different algorithms and interact with the design process at any stage. All relevant design product that is easy to upgrade. The programming methodology utilized has allowed the ability to take full command of the host hardware system. The MDA&O package self-configures to support a wide range of computer platforms. This range can be increased because the hardware shell links at run-time with the technical modules, thus new hardware shells can easily be added.

Original languageEnglish (US)
Title of host publicationCAE/CAD Application to Electronic Packaging
PublisherASME
Pages15-24
Number of pages10
Volume9
StatePublished - 1994
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: Nov 6 1994Nov 11 1994

Other

OtherProceedings of the 1994 International Mechanical Engineering Congress and Exposition
CityChicago, IL, USA
Period11/6/9411/11/94

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Foster, N. F., Dulikravich, G. S., Martin, T. J., & Halderman, J. D. (1994). Interactive multidisciplinary analysis, design and optimization (MDA&O) approach to electronic packaging. In CAE/CAD Application to Electronic Packaging (Vol. 9, pp. 15-24). ASME.