Interfacial reactions and phase stability in the Ni/InP system

Suzanne E. Mohney, Y. Austin Chang

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.

Original languageEnglish (US)
Pages (from-to)393-398
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume337
StatePublished - Dec 1 1994
EventProceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA
Duration: Apr 5 1994Apr 8 1994

Fingerprint

Phase stability
Ohmic contacts
Surface chemistry
Nickel
Thick films
Phase equilibria
Cleaning
Gases
Annealing
electric contacts
Substrates
Processing
cleaning
thick films
examination
nickel
annealing
gases

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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title = "Interfacial reactions and phase stability in the Ni/InP system",
abstract = "Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.",
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Interfacial reactions and phase stability in the Ni/InP system. / Mohney, Suzanne E.; Chang, Y. Austin.

In: Materials Research Society Symposium - Proceedings, Vol. 337, 01.12.1994, p. 393-398.

Research output: Contribution to journalConference article

TY - JOUR

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AU - Chang, Y. Austin

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